Product Overview:
The TE Sensor SQ is used to measure and control the polishing pressure of the CMP.
At various stages in making a microchip, the surface of the wafer has to be made perfectly flat. This is done either to remove excess material,or to create a perfectly flat foundation for adding the next layer of circuit features. To do this, process chemical- mechanical planarization (CMP) remove sand planarizes excess material on the wafer’s front surface by applying precise pressure across the backside of the wafer and pressing the front surface against a rotating pad of special material that also contains a mixture of chemicals and abrasives.
・Whole customized model.
・Can be used for corrosive pressure media
・Fast response time0.1ms.
・Compact design, small size